CELLKIT Tin Solder Wire 0.3mm 50gr
It is a repair material used as an adhesive for components or IC BGAs. With a diameter of 0.3mm suitable for IC / small component repairs.
Diameter (mm): 0.3
Sn: 60%
Pb: 40%
Weight (Gram): 51.49
Packing Dimensions (Cm): 5.5 X 5.5 X 3
