CELLKIT Tin Solder Wire 0.2mm 50gr
It is a repair material used as an adhesive for components or IC BGAs. With a diameter of 0.2mm suitable for IC / small component repairs.
Diameter (mm): 0.2
Sn: 60%
Pb: 40%
Weight (Gram): 51.40
Packing Dimensions (Cm): 5.5 X 5.5 X 3
